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Bump suction cup processing

Bump suction cup processing
Bump suction cup processing Bump suction cup processing Bump suction cup processing Bump suction cup processing

صورة كبيرة :  Bump suction cup processing

تفاصيل المنتج:
مكان المنشأ: الصين
اسم العلامة التجارية: ZG
إصدار الشهادات: CE
رقم الموديل: آنسة
شروط الدفع والشحن:
الحد الأدنى لكمية: 1 جهاز كمبيوتر
الأسعار: 10USD/PC
تفاصيل التغليف: صندوق خشبي قوي للشحن العالمي
وقت التسليم: 5-8 أيام عمل
شروط الدفع: خطاب الاعتماد، D/A، D/P، T/T، ويسترن يونيون، موني جرام
القدرة على العرض: 1000 قطعة

Bump suction cup processing

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Bump Suction Cupprocessing

Bumped suction cups, featuring raised, textured surfaces, are manufactured via precision injection molding using specialized molds to create intricate patterns for enhanced grip, with features as small as 0.3mm and high flatness tolerances (up to 0.03mm). These, often Alumina or SiC-bsed, improve vacuum stability in industrial, medical, and consumer electronics applications.

 

Key Aspects of Bump Suction Cup Processing:
 
 
  • Manufacturing Method: The suction cup main body is created by injecting synthetic resin into a cavity within a primary mold, allowing for customized surface textures.
  • Design Features: The bump structures are engineered to reduce contact area, enhancing anti-static properties, increasing wear resistance, and improving stability, particularly for handling delicate materials like wafers.
  • Materials & Performance: Materials include advanced ceramics like Alumina, which can be coated with Diamond-Like Carbon (DLC), or materials offering high, customizable flatness (down to 1um some cases)
  • Maintenance: Performance is maintained by avoiding excessive heat or chemical exposure and ensuring the surfaces remain clean.
 
 
 
 
 
 
 
 
 
Restoring Suction Cup Functionality:
If a suction cup loses its grip, it can be rejuvenated by boiling it for 2 to 5 minutes to restore its shape and elasticity, then allowing it to cool. Cleaning with warm water and soap also removes dirt that hinders suction.
 
 
 
 
 
 
Parameter indicator Maximum sintering size
Application Wafer inspection, photolithography, etc. Diameter 400, height 500
Bump Diameter (Minimum) 0.2mm Diameter 400, height 40
Flatness(φ350mm) 300mm  
Parallelism 3um  
Maximum panel size ≤350mm  
Materials Silicon carbide, silicon nitride, aluminum nitride, aluminum oxide  

 

Bump suction cup processing 1
 

 

تفاصيل الاتصال
HENAN ZG INDUSTRIAL PRODUCTS CO.,LTD

اتصل شخص: Daniel

الهاتف :: 18003718225

الفاكس: 86-0371-6572-0196

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