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Bump Suction Cupprocessing
Bumped suction cups, featuring raised, textured surfaces, are manufactured via precision injection molding using specialized molds to create intricate patterns for enhanced grip, with features as small as 0.3mm and high flatness tolerances (up to 0.03mm). These, often Alumina or SiC-bsed, improve vacuum stability in industrial, medical, and consumer electronics applications.
| Parameter | indicator | Maximum sintering size |
| Application | Wafer inspection, photolithography, etc. | Diameter 400, height 500 |
| Bump Diameter (Minimum) | 0.2mm | Diameter 400, height 40 |
| Flatness(≤φ350mm) | 300mm | |
| Parallelism | ≤3um | |
| Maximum panel size | ≤350mm | |
| Materials | Silicon carbide, silicon nitride, aluminum nitride, aluminum oxide |
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اتصل شخص: Daniel
الهاتف :: 18003718225
الفاكس: 86-0371-6572-0196